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ISL21060
FGA Technology
The ISL21060 voltage reference floating gate references possess
very low drift and supply current. The charge stored on a floating
gate cell is set precisely in manufacturing. The reference voltage
output itself is a buffered version of the floating gate voltage. The
resulting reference device has excellent characteristics which are
unique in the industry and include very low temperature drift, high
initial accuracy, and almost zero supply current. Also, the reference
voltage itself is not limited by voltage bandgaps or zener settings,
so a wide range of reference voltages can be programmed
(standard voltage settings are provided, but customer-specific
voltages are available).
The process used for these reference devices is a floating gate
CMOS process, and the amplifier circuitry uses CMOS transistors
for amplifier and output drive. This circuitry provides excellent
accuracy with a trade-off in output noise level and load
regulation due to the MOS device characteristics. These
limitations are addressed with circuit techniques discussed in
other sections.
Micropower Supply Current and Output
Enable
The ISL21060 consumes extremely low supply current due to the
proprietary FGA technology. Low noise performance is achieved
using optimized biasing techniques. Supply current is typically
16μA and noise is 10μV P-P , benefitting precision, low noise
portable applications, such as handheld meters and instruments.
The ISL21060 devices have the EN pin, which is used to
Enable/Disable the output of the device. When disabled, the
reference circuitry itself remains biased at a highly accurate and
reliable state. When enabled, the output is driven to the reference
voltage in a relatively short time (about 300 ∝ s). This feature
allows multiple references to be connected and one of them
selected. Another application is to disable any loads that draw
significant current, saving power in standby or shutdown modes.
Board Mounting Considerations
For applications requiring the highest accuracy, board mounting
location should be reviewed. The device uses a plastic SOIC
package, which will subject the die to mild stresses when the PC
board is heated and cooled and slightly changes shape. Placing
the device in areas subject to slight twisting can cause
degradation of the accuracy of the reference voltage due to these
die stresses. It is normally best to place the device near the edge
of a board, or the shortest side, as the axis of bending is most
limited at that location. Mounting the device in a cutout also
minimizes flex. Obviously, mounting the device on flexprint or
extremely thin PC material will likewise cause loss of reference
accuracy.
18
Board Assembly Considerations
FGA? references provide high accuracy and low temperature
drift but some PC board assembly precautions are necessary.
Normal Output voltage shifts of 100μV to 1mV can be expected
with Pb-free reflow profiles or wave solder on multi-layer FR4 PC
boards. Precautions should be taken to avoid excessive heat or
extended exposure to high reflow or wave solder temperatures,
this may reduce device initial accuracy.
Post-assembly x-ray inspection may also lead to permanent
changes in device output voltage and should be minimized or
avoided. If x-ray inspection is required, it is advisable to monitor
the reference output voltage to verify excessive shift has not
occurred. If large amounts of shift are observed, it is best to add an
X-ray shield consisting of thin zinc (300μm) sheeting to allow clear
imaging, yet block x-ray energy that affects the FGA? reference.
Special Applications Considerations
In addition to post-assembly examination, there are also other
X-ray sources that may affect the FGA? reference long term
accuracy. Airport screening machines contain X-rays and will
have a cumulative effect on the voltage reference output
accuracy. Carry-on luggage screening uses low level X-rays and is
not a major source of output voltage shift, although if a product
is expected to pass through that type of screening over 100 times
it may need to consider shielding with copper or aluminum.
Checked luggage X-rays are higher intensity and can cause
output voltage shift in much fewer passes, so devices expected to
go through those machines should definitely consider shielding.
Note that just two layers of 1/2 ounce copper planes will reduce
the received dose by over 90%. The leadframe for the device
which is on the bottom also provides similar shielding.
If a device is expected to pass through luggage X-ray machines
numerous times, it is advised to mount a 2-layer (minimum) PC
board on the top, and along with a ground plane underneath will
effectively shield it from 50 to 100 passes through the machine.
Since these machines vary in X-ray dose delivered, it is difficult to
produce an accurate maximum pass recommendation.
Noise Performance and Reduction
The output noise voltage in a 0.1Hz to 10Hz bandwidth is typically
10μV P-P . The noise measurement is made with a bandpass filter
made of a 1-pole high-pass filter with a corner frequency at 0.1Hz
and a 2-pole low-pass filter with a corner frequency at 12.6Hz to
create a filter with a 9.9Hz bandwidth. Noise in the 10kHz to 1MHz
bandwidth is approximately 100μV P-P with no capacitance on the
output. This noise measurement is made with a 2 decade
bandpass filter made of a 1-pole high-pass filter with a corner
frequency at 1/10 of the center frequency and 1-pole low-pass filter
with a corner frequency at 10x the center frequency. Load
capacitance up to 1μF can be added to improve transient response.
FN6706.6
December 19, 2013
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